NIST seeks sources for a TPT manual wire bonder for semiconductor research.
The National Institute of Standards and Technology (NIST) seeks sources for a TPT Manual Wire Bonder, a specialized piece of equipment used for wire bonding in semiconductor packaging. The device must be capable of wedge bonding with aluminum wire, have a manual operation mode, and include a stereo zoom microscope. NIST requires this for its research and development activities in Gaithersburg, MD. This is a sources sought notice only, not a solicitation; responses will inform future acquisition strategy.