High aspect ratio etch system for microelectronics research.
The Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., represented by the Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), is procuring a system for high aspect ratio etch consisting of a mainframe and process chambers (IPMS-CNT05.1). The system is intended for research purposes in microelectronics. The tender includes the delivery, installation, and commissioning of the equipment. No specific qualifications or set-asides are mentioned. The contract value is not disclosed.