Semi-automated die bonding system for prototyping and light production.
The University of Bristol seeks to purchase a die attach/bonding system for prototyping and light production runs. The system must support ultrasonic, flip-chip, and UV curing bonding processes. It should be semi-automated with motorized controls and capable of storing process recipes for reproducibility. The system must handle bonding runs as small as a single die. No specific qualifications or set-asides are mentioned.